The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Dec. 29, 2014
Applicant:

Sae Magnetics (H.k.) Ltd., Hong Kong, CN;

Inventors:

Chiwai Lo, Hong Kong, CN;

Shenkuang Chou, Hong Kong, CN;

Yiusing Ho, Hong Kong, CN;

Kayip Wong, Hong Kong, CN;

Xiangyuan Tan, DongGuan, CN;

Junqun Zhang, DongGuan, CN;

Assignee:

SAE MAGNETICS (H.K.) LTD., Hong Kong, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); B23K 3/06 (2006.01); B23K 1/005 (2006.01); B23K 1/00 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0623 (2013.01); B23K 1/0016 (2013.01); B23K 1/0056 (2013.01);
Abstract

A nozzle for connecting or disconnecting solder joints between head bonding pads of in a hard disk drive, includes a nozzle body including a tip, the tip disposed at a distal end of the nozzle body and configured to deliver or reflow a solder ball in proximity to head bonding pads; and a central duct disposed along a central axis of the nozzle body and configured to convey the solder ball to or from the tip. The tip includes a front face facing to a trailing edge of a slider, a back face facing to a top surface of a suspension supporting the slider, and two side faces adjacent to the front face and back face respectively, and at least one interference-free structure is provided at two adjacent faces of the tip at least, thereby no interference happens between the tip and elements adjacent to the slider during the operation.


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