The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Jan. 09, 2015
Applicant:

Medtronic, Inc., Minneapolis, MN (US);

Inventors:

Andrew J. Ries, Lino Lakes, MN (US);

SuPing Lyu, Maple Grove, MN (US);

Catherine M. Asgian, Coon Rapids, MN (US);

David Engmark, Bethel, MN (US);

Ananta Pandey, Mounds View, MN (US);

Todd Schaefer, Mounds View, MN (US);

Erik Scott, Maple Grove, MN (US);

Joachim Hossick-Schott, Minneapolis, MN (US);

Assignee:

Medtronic, Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/375 (2006.01); B01D 53/04 (2006.01); H01M 2/10 (2006.01); H01M 10/42 (2006.01);
U.S. Cl.
CPC ...
B01D 53/0407 (2013.01); A61N 1/375 (2013.01); H01M 2/1022 (2013.01); H01M 10/4264 (2013.01); A61N 1/3758 (2013.01); B01D 2253/102 (2013.01); B01D 2253/1122 (2013.01); B01D 2253/202 (2013.01); B01D 2257/108 (2013.01); B01D 2257/80 (2013.01); H01M 2220/30 (2013.01); Y10T 29/49108 (2015.01);
Abstract

Frame structures, assemblies and methods for use in implantable medical devices. The frames may include one or more first polymeric portions and one or more second polymeric portions coupled to the one or more first polymeric portions. The one or more first polymeric portions may have a higher durometer than the one or more second polymeric portions. The one or more second polymeric portions may provide an interference fit between the one or more second polymeric portions and the housing and/or between the one or more second polymeric portions and one or more components disposed in the housing.


Find Patent Forward Citations

Loading…