The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2018

Filed:

Mar. 17, 2016
Applicant:

Ntt Electronics Corporation, Yokohama-shi, Kanagawa, JP;

Inventors:

Kazumasa Yoshida, Yokohama, JP;

Toshiyuki Ozawa, Yokohama, JP;

Teruaki Sato, Yokohama, JP;

Atsushi Tomita, Yokohama, JP;

Yosuke Takeuchi, Yokohama, JP;

Shinji Mino, Yokohama, JP;

Yusuke Nasu, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H05K 3/40 (2006.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/147 (2013.01); H05K 1/028 (2013.01); H05K 1/0237 (2013.01); H05K 1/115 (2013.01); H05K 2201/09027 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A flexible substrate having a branch structure in the related art has problems in that: adhesive strength after two bodies are folded and fixed at a bonding region decreases due to an unfolding and opening force at a curve portion and ends of the bonded portions are peeled off and generate gaps; and in a soldering process of the two bodies, the electrodes of one body soldered first are displaced due to reheating in soldering the other body secondly and deteriorate in soldered connection. The present invention provides a new flexible substrate having a branch structure, including first and second bodies joined together, and having a structure in which one of the bodies can be folded back in a longitudinal direction of the whole flexible substrate. Tip ends of the two bodies are provided with multiple electrodes, and are connected by soldering to approximately corresponding positions on both surfaces of an end portion of a printed substrate concerned.


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