The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2018

Filed:

Jun. 12, 2014
Applicant:

Palo Alto Research Center Incorporated, Palo Alto, CA (US);

Inventor:

Scott J. Limb, Palo Alto, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/24 (2006.01); C22F 1/00 (2006.01); H05K 1/11 (2006.01); B41J 2/16 (2006.01); B23K 26/38 (2014.01); B23K 26/402 (2014.01); H01R 4/01 (2006.01); H01L 41/29 (2013.01); B41J 2/14 (2006.01); H01L 41/047 (2006.01); B23K 103/00 (2006.01); H01R 12/79 (2011.01);
U.S. Cl.
CPC ...
H01R 13/2414 (2013.01); B23K 26/38 (2013.01); B23K 26/402 (2013.01); B41J 2/1631 (2013.01); B41J 2/1639 (2013.01); C22F 1/006 (2013.01); H01L 41/0475 (2013.01); H01L 41/29 (2013.01); H01R 4/01 (2013.01); H05K 1/111 (2013.01); B23K 2203/42 (2015.10); B23K 2203/50 (2015.10); B41J 2/1433 (2013.01); B41J 2/162 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2/1642 (2013.01); H01L 41/047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01R 12/79 (2013.01); H05K 1/112 (2013.01); H05K 1/115 (2013.01);
Abstract

A circuit interconnect generally comprises an electrical connection pad, a shape memory material, and a flowable conductor. The electrical connection pad has an upper surface, a portion of which is covered by the shape memory material. The flowable conductor extends through the shape memory material and is electrically coupled to the electrical connection pad. The shape memory material has a first configuration at a first temperature and a second configuration at a second temperature. In the instance of the second temperature being greater than the first, the shape memory material has a first configuration that is substantially planar and a second configuration that is cupped.


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