The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2018

Filed:

Jul. 28, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Bing Dang, Chappaqua, NY (US);

Duixian Liu, Scarsdale, NY (US);

Jean-Olivier Plouchart, New York, NY (US);

Alberto Valdes-Garcia, Chappaqua, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01P 5/107 (2006.01); H01P 5/02 (2006.01); H01P 3/12 (2006.01); H01P 3/08 (2006.01); H01P 5/08 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01P 3/16 (2006.01); H01Q 1/38 (2006.01); H01Q 1/48 (2006.01); H01Q 1/50 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01P 5/107 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01P 3/08 (2013.01); H01P 3/121 (2013.01); H01P 3/16 (2013.01); H01P 5/02 (2013.01); H01P 5/08 (2013.01); H01P 5/087 (2013.01); H01Q 1/38 (2013.01); H01Q 1/48 (2013.01); H01Q 1/50 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6633 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/17181 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/19031 (2013.01); H01L 2924/19032 (2013.01); H01L 2924/19033 (2013.01); H01L 2924/19039 (2013.01); H05K 1/0243 (2013.01); H05K 2201/037 (2013.01); H05K 2201/10522 (2013.01);
Abstract

Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.


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