The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2018

Filed:

Dec. 19, 2016
Applicant:

Xiamen Sanan Optoelectronics Technology Co., Ltd., Xiamen, CN;

Inventors:

Jin Wang, Tianjin, CN;

Yi-an Lu, Tianjin, CN;

Chun-Yi Wu, Tianjin, CN;

Ching-Shan Tao, Tianjin, CN;

Duxiang Wang, Tianjin, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/38 (2010.01); H01L 33/14 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/38 (2013.01); H01L 33/145 (2013.01); H01L 33/62 (2013.01);
Abstract

A light emitting diode includes: a substrate; a semiconductor light emitting laminate on the substrate, including from bottom up a first semiconductor layer, an active layer, and a second semiconductor layer electrically dissimilar to the first semiconductor layer; a transparent conductive layer with an opening portion; the first electrode electrically connected with the first semiconductor layer; and the second electrode electrically connected with the second semiconductor layer; the second electrode fills the opening portion, and the position where the second electrode contacts the transparent conductive layer is arranged with a recessed portion, and the second electrode is embedded in the transparent conductive layer. The recessed portion is formed on the second electrode, having the second electrode embedded in the transparent conductive layer, increasing the counter force of the second electrode against the horizontal thrust during encapsulation of the LED structure and avoiding detachment during wire bonding for encapsulation.


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