The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2018
Filed:
Dec. 09, 2016
Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;
Toshihiro Iwasaki, Kanagawa, JP;
Takeumi Kato, Kanagawa, JP;
Takanori Okita, Kanagawa, JP;
Yoshikazu Shimote, Kanagawa, JP;
Shinji Baba, Kanagawa, JP;
Kazuyuki Nakagawa, Kanagawa, JP;
Michitaka Kimura, Kanagawa, JP;
Renesas Electronics Corporation, Tokyo, JP;
Abstract
The joint reliability in flip chip bonding of a semiconductor device is enhanced. Prior to flip chip bonding, fluxis applied to the solder bumpsfor flip chip bonding over a substrate and reflow/cleaning is carried out and then flip chip bonding is carried out. This makes is possible to thin the oxide film over the surfaces of the solder bumpsand make the oxide film uniform. As a result, it is possible to suppress the production of local solder protrusions to reduce the production of solder bridges during flip chip bonding and enhance the joint reliability in the flip chip bonding of the semiconductor device.