The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2018

Filed:

May. 01, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Arata Kishi, Fukuoka, JP;

Hiroki Maruo, Fukuoka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 1/00 (2006.01); C22C 28/00 (2006.01); H05K 1/18 (2006.01); B23K 35/26 (2006.01); C22C 12/00 (2006.01); H05K 3/34 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); B23K 1/0016 (2013.01); B23K 35/264 (2013.01); C22C 12/00 (2013.01); C22C 28/00 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/3457 (2013.01); H01L 2224/05609 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0543 (2013.01); H01L 2924/0544 (2013.01); H01L 2924/0549 (2013.01);
Abstract

There is provided a connection structure of a circuit member including: a first circuit member having a first main surface provided with a first electrode; a second circuit member having a second main surface provided with a second electrode; and a joining portion which is interposed between the first main surface and the second main surface, in which the joining portion has a solder portion which electrically connects the first electrode and the second electrode to each other, in which the solder portion contains a bismuth-indium alloy, and in which an amount of bismuth contained in the bismuth-indium alloy exceeds 20% by mass and is equal to or less than 80% by mass.


Find Patent Forward Citations

Loading…