The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2018

Filed:

Mar. 12, 2015
Applicant:

Hitachi, Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Masato Hayashi, Tokyo, JP;

Chihiro Yoshimura, Tokyo, JP;

Masanao Yamaoka, Tokyo, JP;

Assignee:

HITACHI, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 7/60 (2006.01); G06F 17/10 (2006.01); G06F 17/50 (2006.01); G06N 7/00 (2006.01); G06N 99/00 (2010.01); G11C 11/16 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5009 (2013.01); G06N 7/005 (2013.01); G06N 99/002 (2013.01); G11C 11/1659 (2013.01);
Abstract

A semiconductor device is provided with a plurality of semiconductor chips, each of which simulates interactions between nodes of an interaction model, and an inter-chip wire, wherein the plurality of semiconductor chips are used to simulate interactions between nodes of a single interaction model; each semiconductor chip includes a connection unit that sends and receives some of the values indicating the state of the nodes, which are retained by a necessary element unit, via inter-chip wire to and from another semiconductor chip or sends and receives the values indicating state of the nodes, which are retained by the necessary element unit to and from the other semiconductor chip while sharing the inter-chip wire by means of time sharing.


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