The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2018

Filed:

Dec. 18, 2015
Applicant:

Ntn Corporation, Osaka, JP;

Inventors:

Kazuo Hirose, Mie, JP;

Hiroshi Yanagawa, Mie, JP;

Yuuki Yamazoe, Mie, JP;

Assignee:

NTN CORPORATION, Osaka, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03G 15/20 (2006.01); B23K 26/22 (2006.01); C09J 183/04 (2006.01);
U.S. Cl.
CPC ...
G03G 15/2028 (2013.01); B23K 26/22 (2013.01); G03G 15/2085 (2013.01); C09J 183/04 (2013.01); G03G 2215/2016 (2013.01);
Abstract

To provide a manufacturing method for a peeling member in which a non-adhesive resin film formed by fluororesin resin or the like is adhered to a metal plate, the method capable of manufacturing the peeling member which can prevent adhesion of a paper right after fixing for a long period of time with high productivity and without variations in quality. The manufacturing method for the peeling member provided with a peeling sheetformed by a metal plateand a non-adhesive resin filmadhered to the metal plate, the manufacturing method including a groove forming step of forming a pattern portionformed by a plurality of recessed grooves on at least a part of a paper passing side surface of the non-adhesive resin filmalong a longitudinal direction of the non-adhesive resin film


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