The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2018

Filed:

Jul. 10, 2015
Applicant:

Honeywell International Inc., Morristown, NJ (US);

Inventors:

Paul W. Dwyer, Seattle, WA (US);

John Stanley Starzynski, North Bend, WA (US);

Assignee:

Honeywell International Inc., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P 15/18 (2013.01); G01P 15/125 (2006.01); G01P 15/13 (2006.01); G01P 15/08 (2006.01);
U.S. Cl.
CPC ...
G01P 15/125 (2013.01); G01P 15/132 (2013.01); B81B 2201/0235 (2013.01); G01P 15/0802 (2013.01); G01P 15/18 (2013.01); G01P 2015/0857 (2013.01);
Abstract

In some examples, the disclosure describes an accelerometer having improved hysteresis effects, the accelerometer including a proof mass assembly including a proof mass, a support structure, and a flexure flexibly connecting the proof mass to the support structure to allow the proof mass to move about the plane defined by the support structure. Some examples may include at least one thin film lead including an electrically conductive material on the flexure, where the at least one thin film lead provides an electrical connection between an electrical component on the support structure and an electrical component on the proof mass, and where the at least one thin film lead comprises at least one of a yield strength greater than pure gold or a thermal expansion coefficient less than pure gold.


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