The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2018

Filed:

Dec. 17, 2013
Applicant:

Okuno Chemical Industries Co., Ltd., Osaka-shi, Osaka, JP;

Inventors:

Junji Yoshikawa, Osaka, JP;

Yukiya Takeuchi, Osaka, JP;

Koji Kita, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/40 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); C23C 18/24 (2006.01); C23C 18/28 (2006.01); C23C 18/30 (2006.01); C25D 5/14 (2006.01); C25D 5/34 (2006.01); C25D 5/54 (2006.01); C25D 3/38 (2006.01); B05D 1/18 (2006.01); C09D 5/24 (2006.01);
U.S. Cl.
CPC ...
C25D 5/54 (2013.01); B05D 1/18 (2013.01); C09D 5/24 (2013.01); C23C 18/40 (2013.01); C25D 5/34 (2013.01); C23C 18/1653 (2013.01); C23C 18/2086 (2013.01); C23C 18/24 (2013.01); C23C 18/285 (2013.01); C23C 18/30 (2013.01); C25D 3/38 (2013.01);
Abstract

This invention relates to a conductive-coating bath comprising an aqueous solution containing (A) a copper compound, (B) a complexing agent, (C) an alkali metal hydroxide, (D) a Caliphatic polyalcohol compound, and (E) at least one compound selected from the group consisting of reducing compounds having a —COOM group, wherein M is hydrogen, an alkali metal, or a —NHgroup, and reducing saccharides having six or more carbon atoms. The present invention provides a composition for forming a conductive coating having excellent properties as a base layer for electroplating, which is effectively used to form a uniform decorative coating having excellent appearance by electroplating on a non-conductive plastic molding.


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