The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2018
Filed:
Mar. 19, 2015
Applicants:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Mgc Filsheet Co., Ltd., Saitama, JP;
Inventor:
Atsuhiro Tokita, Tokyo, JP;
Assignees:
MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;
MGC FILSHEET CO., LTD., Saitama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/46 (2006.01); B29C 47/00 (2006.01); B29D 11/00 (2006.01); B29C 47/14 (2006.01); B29K 33/00 (2006.01); B29K 69/00 (2006.01); B29L 7/00 (2006.01); B29L 11/00 (2006.01); B29C 47/16 (2006.01);
U.S. Cl.
CPC ...
B29C 47/004 (2013.01); B29C 43/46 (2013.01); B29C 47/0021 (2013.01); B29C 47/14 (2013.01); B29D 11/00663 (2013.01); B29C 47/16 (2013.01); B29C 2043/466 (2013.01); B29K 2033/08 (2013.01); B29K 2069/00 (2013.01); B29K 2995/0026 (2013.01); B29L 2007/008 (2013.01); B29L 2011/0075 (2013.01);
Abstract
The manufacturing apparatus of the present invention comprises a die for extruding a resin plate and a first roller and a second roller for molding the resin plate. The manufacturing apparatus further comprises: an inner deckel for dividing the resin plate and pre-forming a thick section; and a main molding section provided on the first roller and/or the second roller for molding a non-uniform thickness section from the thick section.