The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2018
Filed:
Dec. 05, 2017
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Bryan P. Kiple, Los Gatos, CA (US);
Charles B. Woodhull, San Francisco, CA (US);
David A. Pakula, San Francisco, CA (US);
Tang Y. Tan, San Francisco, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/04 (2006.01); B23P 17/00 (2006.01); H05K 5/02 (2006.01); G03F 1/38 (2012.01); H04M 1/02 (2006.01); H01Q 1/24 (2006.01); B23C 5/10 (2006.01); H04M 1/11 (2006.01); B23C 5/00 (2006.01); B23P 17/02 (2006.01); C25D 11/34 (2006.01); C25D 11/12 (2006.01); C25D 11/02 (2006.01); H01Q 1/42 (2006.01); H05K 5/03 (2006.01); C25D 7/00 (2006.01); H05K 13/00 (2006.01); B23P 11/00 (2006.01); C25D 11/24 (2006.01);
U.S. Cl.
CPC ...
H05K 5/04 (2013.01); B23C 5/00 (2013.01); B23C 5/1081 (2013.01); B23P 11/00 (2013.01); B23P 17/00 (2013.01); B23P 17/02 (2013.01); C25D 7/00 (2013.01); C25D 11/02 (2013.01); C25D 11/022 (2013.01); C25D 11/12 (2013.01); C25D 11/34 (2013.01); G03F 1/38 (2013.01); H01Q 1/243 (2013.01); H01Q 1/42 (2013.01); H04M 1/0254 (2013.01); H04M 1/11 (2013.01); H05K 5/02 (2013.01); H05K 5/0217 (2013.01); H05K 5/0243 (2013.01); H05K 5/0247 (2013.01); H05K 5/03 (2013.01); H05K 13/00 (2013.01); B23C 2220/04 (2013.01); B23C 2220/16 (2013.01); B23C 2220/20 (2013.01); B23C 2220/28 (2013.01); B23C 2220/48 (2013.01); B23C 2226/31 (2013.01); B23C 2226/315 (2013.01); C25D 11/246 (2013.01); H04M 1/0249 (2013.01); Y10T 29/47 (2015.01); Y10T 29/49002 (2015.01); Y10T 29/49826 (2015.01); Y10T 156/10 (2015.01); Y10T 156/1064 (2015.01); Y10T 407/1906 (2015.01); Y10T 409/300896 (2015.01); Y10T 409/30952 (2015.01); Y10T 409/303752 (2015.01);
Abstract
Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.