The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Sep. 17, 2015
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Inventors:

Tokihito Suwa, Hitachinaka, JP;

Yujiro Kaneko, Hitachinaka, JP;

Yusuke Takagi, Hitachinaka, JP;

Shinichi Fujino, Mito, JP;

Takahiro Shimura, Mito, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); H05K 7/14 (2006.01); H02M 7/537 (2006.01); H05K 7/20 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/473 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0247 (2013.01); H01L 23/473 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/34 (2013.01); H01L 24/36 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H02M 7/537 (2013.01); H05K 7/1432 (2013.01); H05K 7/2089 (2013.01); H05K 7/20845 (2013.01); H05K 7/20927 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/48 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/351 (2013.01);
Abstract

A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed.


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