The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Jun. 23, 2017
Applicant:

Averatek Corporation, Santa Clara, CA (US);

Inventors:

Mihir Reddy, Pleasanton, CA (US);

Michael Riley Vinson, Sunnyvale, CA (US);

Sunity K. Sharma, Fremont, CA (US);

Assignee:

AVERATEK CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/18 (2006.01); C23C 18/18 (2006.01); C23C 18/00 (2006.01); C23C 18/20 (2006.01); C23C 18/16 (2006.01); C23C 18/38 (2006.01); C23C 18/32 (2006.01); C23C 18/30 (2006.01);
U.S. Cl.
CPC ...
H05K 3/184 (2013.01); C23C 18/00 (2013.01); C23C 18/161 (2013.01); C23C 18/1608 (2013.01); C23C 18/1817 (2013.01); C23C 18/1841 (2013.01); C23C 18/1844 (2013.01); C23C 18/1865 (2013.01); C23C 18/1889 (2013.01); C23C 18/1893 (2013.01); C23C 18/208 (2013.01); C23C 18/2033 (2013.01); C23C 18/2086 (2013.01); C23C 18/30 (2013.01); C23C 18/32 (2013.01); C23C 18/38 (2013.01); H05K 2203/0565 (2013.01); H05K 2203/125 (2013.01);
Abstract

Methods and devices for patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate can be covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.


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