The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Aug. 01, 2014
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Jin Mi Jung, Daejeon, KR;

Jae Jin Kim, Daejeon, KR;

Jeong Ho Park, Daejeon, KR;

Bu Gon Shin, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/00 (2006.01); C08J 7/18 (2006.01); G21H 5/00 (2006.01); H05K 3/10 (2006.01); H05K 1/02 (2006.01); H05K 3/20 (2006.01); B32B 15/04 (2006.01); H01L 51/00 (2006.01); H01L 51/44 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H05K 3/10 (2013.01); B32B 15/04 (2013.01); H05K 1/0283 (2013.01); H05K 3/20 (2013.01); B32B 2457/12 (2013.01); H01L 51/003 (2013.01); H01L 51/0021 (2013.01); H01L 51/441 (2013.01); H01L 51/5203 (2013.01); H05K 1/028 (2013.01); H05K 2201/0382 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1105 (2013.01);
Abstract

The present application relates to a method of preparing a metal pattern having a 3D structure, a metal pattern laminate, and use of the metal pattern laminate. According to the method of preparing a metal pattern, the metal pattern having a 3D structure can be effectively formed on a receptor. Especially, the metal pattern having a 3D structure can also be effectively and rapidly transferred to a surface of the receptor, such as, a flexible substrate, to which the metal pattern is not easily transferred. The metal pattern laminate prepared using the method can, for example, be usefully used for metal layers of flexible electronic devices or metal interconnection lines.


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