The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2018
Filed:
Oct. 19, 2015
Korea Institute of Machinery & Materials, Daejeon, KR;
Yong-Jin Kim, Daejeon, KR;
Jae-Hak Lee, Daejeon, KR;
Ju-Yong Lee, Incheon, KR;
Joon-Yub Song, Daejeon, KR;
Seung-Man Kim, Daejeon, KR;
Chang-Woo Lee, Daejeon, KR;
Tae-Ho Ha, Daejeon, KR;
KOREA INSTITUTE OF MACHINERY & MATERIALS, Daejeon, KR;
Abstract
In a flexible substrate and a method for manufacturing the flexible substrate, the flexible substrate includes a polymer substrate, a through conductive material, an upper conductive material and a lower conductive material. The polymer substrate has a via-hole, and the via-hole is formed by a pattern formed via a photolithography and passes through the polymer substrate. The through conductive material fills the via-hole of the polymer substrate. The upper conductive material is planarized and is patterned to form an upper substrate of the polymer substrate in a plane with an upper substrate of the through conductive material. The lower conductive material is planarized and is patterned to form a lower substrate of the polymer substrate in a plane with a lower substrate of the through conductive material.