The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Apr. 11, 2017
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Russ Alan Reisner, Newbury Park, CA (US);

Joel Richard King, Newbury Park, CA (US);

Ziv Alon, Thousand Oaks, CA (US);

Tin Wai Kwan, Thousand Oaks, CA (US);

Aleksey A. Lyalin, Thousand Oaks, CA (US);

Xiaodong Xu, Oak Park, CA (US);

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/44 (2006.01); H04B 1/40 (2015.01); H03F 3/19 (2006.01); H01L 29/737 (2006.01); H04W 72/04 (2009.01); H01L 23/66 (2006.01); H03F 3/24 (2006.01); H03F 3/195 (2006.01); H01L 25/00 (2006.01); H03F 1/56 (2006.01); H03F 3/21 (2006.01); H04W 84/04 (2009.01); H04B 1/04 (2006.01);
U.S. Cl.
CPC ...
H04B 1/40 (2013.01); H01L 23/66 (2013.01); H01L 25/50 (2013.01); H01L 29/737 (2013.01); H03F 1/56 (2013.01); H03F 3/19 (2013.01); H03F 3/195 (2013.01); H03F 3/211 (2013.01); H03F 3/245 (2013.01); H04B 1/0458 (2013.01); H04W 72/0453 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H03F 2200/111 (2013.01); H03F 2200/451 (2013.01); H03F 2200/534 (2013.01); H03F 2203/21106 (2013.01); H03F 2203/21139 (2013.01); H03F 2203/21142 (2013.01); H04B 2001/0408 (2013.01); H04W 84/042 (2013.01);
Abstract

Systems, devices and methods related to stacked band selection switch devices. In some embodiments, an RF module can include a packaging substrate and a power amplifier (PA) assembly implemented on a PA die mounted on the packaging substrate. The RF module can further include an output matching network (OMN) device mounted on the packaging substrate and a band selection switch device mounted on the OMN device. The OMN device can be configured to provide output matching functionality for at least a portion of the PA assembly.


Find Patent Forward Citations

Reisner, Russ. (2018). Systems, devices and methods related to stacked radio-frequency devices (U.S. Patent No. 10033423). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10033423

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…