The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Jan. 07, 2016
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Bradley O. Hansen, Vail, AZ (US);

Michael R. Beylor, Vail, AZ (US);

Kevin W. Patrick, Tucson, AZ (US);

Jeremy Bart Baldwin, Sahuarita, AZ (US);

Michael D. Gordon, Tucson, AZ (US);

Assignee:

RAYTHEON COMPANY, Waltham, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 1/203 (2006.01); H01P 3/08 (2006.01);
U.S. Cl.
CPC ...
H01P 1/203 (2013.01); H01P 1/20345 (2013.01); H01P 1/20363 (2013.01); H01P 3/088 (2013.01);
Abstract

A filter assembly in a multi-layer printed wiring board. One or more conductors is formed on an internal layer of a printed wiring board. Surrounding dielectric layers and ground layers form, together with the conductors of the internal layer, microstrip or stripline transmission lines and distributed element filters. The filter assembly may include a plurality of internal conductive layers, each sandwiched between dielectric layers and ground layers, and each internal layer may include a plurality of distributed element filters. Connections from each filter to the surface of the filter assembly are formed by vias, and connections from the surface of the filter assembly to a host board are formed by solder joints.


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