The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Nov. 14, 2012
Applicant:

Koito Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Tetsuya Suzuki, Shizuoka, JP;

Akihiro Matsumoto, Shizuoka, JP;

Tomoyuki Nakagawa, Shizuoka, JP;

Naoki Sone, Shizuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/52 (2010.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 33/52 (2013.01); H01L 33/005 (2013.01); H01L 33/56 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2933/005 (2013.01);
Abstract

Provided is a light emitting module in which an LED device is mounted and power is supplied to the LED device by a gold wire. The light emitting module includes a first resin (sealing material) that seals the gold wire and a second resin (dam wall) that surrounds at least a portion of the outer peripheral of the first resin. The first resin has a lower viscosity and a lower elastic modulus compared to the second resin, and protects the gold wire mechanically and chemically. The second resin suppresses the first resin from being flowed out toward the peripherals, and, as a result, the sealing state of the gold wire by the first resin may be maintained.


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