The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2018
Filed:
Feb. 08, 2016
Applicant:
Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/267 (2006.01); H01L 29/739 (2006.01); H01L 29/08 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0661 (2013.01); H01L 29/0619 (2013.01); H01L 29/0865 (2013.01); H01L 29/267 (2013.01); H01L 29/66333 (2013.01); H01L 29/66712 (2013.01); H01L 29/7395 (2013.01); H01L 29/7811 (2013.01);
Abstract
A power semiconductor device is provided. The power semiconductor device includes a substrate having a device region and a surrounding termination region; and at least a power device formed in the device region of the substrate. The power semiconductor substrate also includes a termination structure having a plurality of semiconductor plugs formed in a first surface of the termination region of the substrate. Wherein the plurality of the semiconductor plugs are formed in a plurality of ring trenches formed in the first surface of the substrate in the termination regions, with a semiconductor plug formed in each of the plurality of ring trenches.