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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10032802 B1

PDFFull Text
Date of Patent:
Jul. 24, 2018

Filed:

Apr. 23, 2015

Thin-film transistor device and display device using same

Applicant:

Joled Inc., Chiyoda-ku, Tokyo, JP;

Inventors:

Yasuharu Shinokawa, Tokyo, JP;

Kenichi Nendai, Tokyo, JP;

Takashi Osako, Tokyo, JP;

Assignee:

JOLED INC., Tokyo, JP;

Attorney:

Hauptman Ham, LLP

Primary Examiner:

Kimberly Rizkallah

Assistant Examiner:

Bo Bin Jang

Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/786 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 51/50 (2006.01); H01L 27/32 (2006.01); H05B 33/06 (2006.01); H05B 33/22 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); H01L 21/768 (2013.01); H01L 23/522 (2013.01); H01L 27/32 (2013.01); H01L 27/322 (2013.01); H01L 27/3246 (2013.01); H01L 27/3272 (2013.01); H01L 29/786 (2013.01); H01L 51/50 (2013.01); H01L 51/5056 (2013.01); H01L 51/5072 (2013.01); H01L 51/5088 (2013.01); H01L 51/5237 (2013.01); H05B 33/06 (2013.01); H05B 33/22 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A display device including: a lead wiring layer pattern, made from metal, that extends outside a light emission region on a substrate; a passivation layercovering the lead wiring layer pattern, a contact holein the passivation layer outside the light emission region; a connecting wiring layer patternthat is continuous across the passivation layer, an inner circumference of the contact hole, and the lead wiring layer pattern in the contact hole; an electrically-conductive sealing layer patternon the connecting wiring layer pattern, covering a portion of the connecting wiring layer pattern in the contact hole; an electrically-conductive upper sealing layer patterncovering and in contact with a portion of the sealing layer pattern; and a contact prevention layer patternbetween the electrically-conductive upper sealing layer pattern and a periphery of the sealing layer pattern.

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