The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

May. 19, 2015
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventor:

Wolfgang Werner, Munich, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H01L 29/66 (2006.01); H01L 29/872 (2006.01); H01L 29/78 (2006.01); H01L 29/267 (2006.01); H01L 29/808 (2006.01); H01L 29/04 (2006.01); H01L 29/16 (2006.01); H01L 29/165 (2006.01); H01L 29/20 (2006.01); H01L 29/861 (2006.01); H01L 29/10 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 29/04 (2013.01); H01L 29/1095 (2013.01); H01L 29/1604 (2013.01); H01L 29/165 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/267 (2013.01); H01L 29/66068 (2013.01); H01L 29/66431 (2013.01); H01L 29/66734 (2013.01); H01L 29/66893 (2013.01); H01L 29/66909 (2013.01); H01L 29/66924 (2013.01); H01L 29/7395 (2013.01); H01L 29/78 (2013.01); H01L 29/7805 (2013.01); H01L 29/7806 (2013.01); H01L 29/7813 (2013.01); H01L 29/8083 (2013.01); H01L 29/8611 (2013.01); H01L 29/872 (2013.01); H01L 2924/0002 (2013.01);
Abstract

According to an embodiment of a semiconductor device, the semiconductor device includes a semiconductor body having a main surface, the semiconductor body including a drift region of a first band-gap material, the drift region being of a first conductivity type, and a metallization arranged at the main surface. In a cross-section which is substantially orthogonal to the main surface, the semiconductor body further includes a contact region of the first band-gap material directly adjoining the drift region and the metallization, and an anode region of a second band-gap material having a lower band-gap than the first band-gap material. The contact region is of a second conductivity type. The anode region is in ohmic contact with the metallization and forms a heterojunction with the drift region.


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