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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10032747 B1

PDFFull Text
Date of Patent:
Jul. 24, 2018

Filed:

Mar. 18, 2016

Light emitting diode package structure and manufacturing method thereof

Applicant:

Genesis Photonics Inc., Tainan, TW;

Inventors:

Chin-Hua Hung, Tainan, TW;

Yu-Feng Lin, Tainan, TW;

Assignee:

GENESIS PHOTONICS INC., Tainan, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Phat X Cao

Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 33/60 (2010.01); H01L 33/08 (2010.01); H01L 33/52 (2010.01); H01L 27/02 (2006.01); H01L 23/00 (2006.01); H01L 33/10 (2010.01); H01L 33/50 (2010.01); H01L 23/60 (2006.01); H01L 29/866 (2006.01); H01L 33/48 (2010.01); H01L 27/15 (2006.01); H01L 33/64 (2010.01); H01L 25/075 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 23/562 (2013.01); H01L 23/60 (2013.01); H01L 25/0657 (2013.01); H01L 25/0756 (2013.01); H01L 27/0248 (2013.01); H01L 27/15 (2013.01); H01L 29/866 (2013.01); H01L 33/08 (2013.01); H01L 33/10 (2013.01); H01L 33/48 (2013.01); H01L 33/486 (2013.01); H01L 33/50 (2013.01); H01L 33/502 (2013.01); H01L 33/52 (2013.01); H01L 33/60 (2013.01); H01L 33/642 (2013.01); H01L 33/647 (2013.01); H01L 25/0753 (2013.01); H01L 33/508 (2013.01); H01L 33/56 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49107 (2013.01); H01L 2924/18161 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A light emitting diode package structure and a manufacturing method thereof are disclosed. The light emitting diode package structure includes a carrier substrate, a electrostatic protection component, and a light-emitting diode (LED). The carrier substrate has a first conductive pad and a second conductive pad. The electrostatic protection component is disposed on the carrier substrate and has a first electrode and a second electrode, wherein the first electrode and the second electrode are electrically connected to the first conductive pad and the second conductive pad respectively. The LED is disposed on the electrostatic protection component and has a third electrode and a fourth electrode, wherein the third electrode and the fourth electrode are electrically connected to the first conductive pad and the second conductive pad respectively.

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