The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Jun. 27, 2017
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventors:

Yasuyuki Kawada, Tsukuba, JP;

Takeshi Tawara, Tsukuba, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/04 (2006.01); H01L 29/161 (2006.01); H01L 29/78 (2006.01); H01L 23/544 (2006.01); H01L 21/66 (2006.01); H01L 21/20 (2006.01); H01L 21/336 (2006.01); H01L 29/66 (2006.01); H01L 29/16 (2006.01); H01L 21/04 (2006.01); H01L 29/423 (2006.01); H01L 21/02 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/02378 (2013.01); H01L 21/02433 (2013.01); H01L 21/02529 (2013.01); H01L 21/049 (2013.01); H01L 21/0475 (2013.01); H01L 22/12 (2013.01); H01L 29/045 (2013.01); H01L 29/1608 (2013.01); H01L 29/4236 (2013.01); H01L 29/66045 (2013.01); H01L 29/7397 (2013.01); H01L 29/7813 (2013.01); H01L 2223/54493 (2013.01);
Abstract

On a first epitaxial layer of a first conductivity type or a second conductivity type provided on a front surface of a silicon carbide substrate, a mark indicating a crystal axis direction of the silicon carbide substrate within a margin of error of one degree is provided. The mark is created on the silicon carbide substrate by forming the first epitaxial layer of the first conductivity type or the second conductivity type on the front surface of the silicon carbide substrate, detecting a stacking fault from the first epitaxial layer, and confirming the crystal axis direction of the silicon carbide substrate from the detected stacking fault.


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