The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Mar. 03, 2016
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventor:

Atsushi Ishimaru, Yokohama Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01L 23/522 (2006.01); H01L 27/12 (2006.01); H01L 29/06 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 23/66 (2006.01); H03K 17/693 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 23/528 (2013.01); H01L 23/53214 (2013.01); H01L 23/53228 (2013.01); H01L 23/53261 (2013.01); H01L 23/66 (2013.01); H01L 27/1203 (2013.01); H01L 29/0649 (2013.01); H03K 17/693 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6677 (2013.01);
Abstract

A semiconductor switch includes an insulating film on a semiconductor substrate. A switching circuit is on a first portion of the insulating film. The switching circuit is configured to switch a path of a high-frequency signal. A wiring layer is provided on the insulating film. The wiring layering includes a signal wire and a ground wire. A conductive layer is between the wiring layer and the insulating film. The conductive layer, in some embodiments, includes a first conductive region between the high-frequency wiring and the insulating film and a second conductive region between the grounding wiring and the insulating film.


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