The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

May. 30, 2017
Applicant:

Vanguard International Semiconductor Corporation, Hsinchu, TW;

Inventors:

Li-Che Chen, Hsinchu, TW;

Chien-Wei Chiu, Beigang Township, TW;

Chien-Hsien Song, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 27/06 (2006.01); H01L 29/41 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823462 (2013.01); H01L 21/823437 (2013.01); H01L 27/0629 (2013.01); H01L 29/413 (2013.01);
Abstract

A method for manufacturing a semiconductor device includes forming a first gate structure on a semiconductor substrate. The first gate structure includes a first gate dielectric layer and a first gate electrode layer formed thereon. The method also includes forming an insulating material layer on the semiconductor substrate, wherein the semiconductor substrate and the first gate structure are covered by the insulating material layer. The method further includes removing a portion of the insulating material layer in a high-voltage element region to form a second gate dielectric layer in the high-voltage element region on the semiconductor substrate, and forming a second gate electrode layer on the second gate dielectric layer.


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