The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Feb. 04, 2017
Applicant:

Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;

Inventor:

Masaaki Shinohara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 21/768 (2006.01); H01L 21/265 (2006.01); H01L 21/266 (2006.01); H01L 21/28 (2006.01); H01L 27/11568 (2017.01); H01L 27/11573 (2017.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76895 (2013.01); H01L 21/266 (2013.01); H01L 21/26513 (2013.01); H01L 21/28282 (2013.01); H01L 21/76805 (2013.01); H01L 21/823487 (2013.01); H01L 27/11568 (2013.01); H01L 27/11573 (2013.01); H01L 29/665 (2013.01); H01L 29/66545 (2013.01); H01L 29/66575 (2013.01); H01L 29/66833 (2013.01);
Abstract

When a MISFET is formed by using a gate last process and replacing dummy gate electrodes with metal gate electrodes, both of respective cap insulating films and an interlayer insulating film over a control gate electrode and the dummy gate electrodes are polished to prevent excessive polishing of the upper surface of the interlayer insulating film and the occurrence of dishing. In the gate last process, the interlayer insulating film is formed to cover the control gate electrode and the dummy gate electrodes as well as the cap insulating films located thereover. After the upper surface of the interlayer insulating is polished to expose the cap insulating films from the interlayer insulating films, etching is performed to selectively remove the cap insulating films. Subsequently, the upper surfaces of the interlayer insulating films are polished.


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