The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

May. 28, 2013
Applicants:

Nakayama Amorphous Co., Ltd., Osaka, JP;

Manabu Kiuchi, Tokyo, JP;

Usui Kokusai Sangyo Kaisya, Ltd., Shizuoka, JP;

Yamanaka Eng. Co, Ltd., Osaka, JP;

Inventors:

Ryurou Kurahashi, Osaka, JP;

Junji Takehara, Osaka, JP;

Shigeo Kakudou, Osaka, JP;

Tsunehiro Mimura, Osaka, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/14 (2006.01); H01M 2/16 (2006.01); C22C 45/00 (2006.01); H01M 8/0206 (2016.01); H01B 1/18 (2006.01); C23C 4/06 (2016.01); C23C 4/10 (2016.01); C23C 4/12 (2016.01); C22C 45/04 (2006.01); C22C 19/05 (2006.01); C22C 1/00 (2006.01); C22C 1/02 (2006.01); H01M 8/0223 (2016.01); B22D 23/00 (2006.01); C21D 1/18 (2006.01); B22F 3/115 (2006.01); B22D 23/06 (2006.01); H01M 8/1018 (2016.01); C22C 1/04 (2006.01); C22C 1/10 (2006.01);
U.S. Cl.
CPC ...
H01B 1/18 (2013.01); B22D 23/003 (2013.01); B22F 3/115 (2013.01); C21D 1/18 (2013.01); C22C 1/002 (2013.01); C22C 1/02 (2013.01); C22C 19/058 (2013.01); C22C 45/00 (2013.01); C22C 45/04 (2013.01); C23C 4/06 (2013.01); C23C 4/10 (2013.01); C23C 4/12 (2013.01); H01M 2/145 (2013.01); H01M 2/1646 (2013.01); H01M 8/0206 (2013.01); H01M 8/0223 (2013.01); B22D 23/06 (2013.01); B22F 2998/10 (2013.01); C22C 1/0433 (2013.01); C22C 1/1036 (2013.01); H01M 2008/1095 (2013.01); H01M 2250/10 (2013.01); H01M 2250/20 (2013.01); H01M 2250/30 (2013.01); Y02B 90/14 (2013.01); Y02B 90/18 (2013.01); Y02P 70/56 (2015.11); Y02T 90/32 (2013.01);
Abstract

A thin plate is prepared by an ultraquenching transition control injector with a mixture of a metal powder having corrosion resistance to form a matrix and a powder having conductivity, as a raw material. When the matrix of the thin plate is crystal-structure metal, the plate can be formed at room temperature, and when the matrix is metallic glass, the plate can be formed in a supercooled liquid state. Therefore the plate can be finished into a separator with an intended shape.


Find Patent Forward Citations

Loading…