The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Aug. 21, 2017
Applicant:

Funai Electric Co., Ltd., Osaka, JP;

Inventors:

David L. Bernard, Lexington, KY (US);

Christopher A. Craft, Lexington, KY (US);

David C. Graham, Lexington, KY (US);

Sean T. Weaver, Lexington, KY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); G03F 7/00 (2006.01); G03F 7/095 (2006.01); G03F 7/038 (2006.01); B81C 1/00 (2006.01); B81B 1/00 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0037 (2013.01); B41J 2/14 (2013.01); B41J 2/162 (2013.01); B41J 2/1631 (2013.01); B81B 1/002 (2013.01); B81C 1/00619 (2013.01); G03F 7/0035 (2013.01); G03F 7/038 (2013.01); B81B 2201/052 (2013.01);
Abstract

A three-dimensional ('3D') structure for handling fluids, a fluid handling device containing the 3D structure, and a method of making the 3D structure. The method includes providing a composite photoresist material that includes: (a) a first photoresist layer derived from a photoresist resin having a first chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density and (b) at least a second photoresist layer derived from a photoresist resin having a second chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density different from the first chemical property. The composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material and the composite photoresist material has varying mechanical and/or physical properties through a thickness of the 3D structure.


Find Patent Forward Citations

Loading…