The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Apr. 16, 2015
Applicants:

Yamamoto-ms Co., Ltd., Shibuya-ku, Tokyo, JP;

Kiyokawa Plating Industry Co., Ltd., Fukui-shi, Fukui, JP;

Inventors:

Wataru Yamamoto, Tokyo, JP;

Fumio Harada, Tokyo, JP;

Hajime Kiyokawa, Fukui, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25B 9/00 (2006.01); C25D 5/08 (2006.01); C25D 17/02 (2006.01); C23C 18/16 (2006.01); C25D 17/00 (2006.01); C25D 3/38 (2006.01); C25D 17/06 (2006.01); C25D 17/10 (2006.01); C25D 21/10 (2006.01);
U.S. Cl.
CPC ...
C25D 5/08 (2013.01); C23C 18/163 (2013.01); C23C 18/1619 (2013.01); C23C 18/1664 (2013.01); C25D 17/00 (2013.01); C25D 17/02 (2013.01); C23C 18/1632 (2013.01); C25D 3/38 (2013.01); C25D 17/005 (2013.01); C25D 17/06 (2013.01); C25D 17/10 (2013.01); C25D 21/10 (2013.01);
Abstract

Provided are a plating apparatus and a container bath, which have a simpler structure than a conventional system and are capable of improving uniformity of a plating thickness. The plating apparatus includes a plating tank which stores a plating liquid, an anode member arranged inside the plating tank, a plating object arranged inside the plating tank to face the anode member, a cathode jig which contacts with the plating object, and a space formed between the anode member and the plating object to be a flow passage to which the plating liquid flows from the plating tank. The plating liquid flows into the space from above relative to the space, and is sucked by a pump from below relative to the space.


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