The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Aug. 21, 2015
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Laura Cerully Dial, Clifton Park, NY (US);

William Thomas Carter, Galway, NY (US);

Michael Francis Xavier Gigliotti, Jr., Glenville, NY (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 10/08 (2006.01); C23C 10/28 (2006.01); C23C 10/02 (2006.01); C23C 10/60 (2006.01); C23F 1/20 (2006.01); C23F 1/44 (2006.01); C23F 17/00 (2006.01); C23C 10/30 (2006.01); C25D 5/50 (2006.01); C23C 24/08 (2006.01); C25D 3/12 (2006.01);
U.S. Cl.
CPC ...
C23C 10/08 (2013.01); C23C 10/02 (2013.01); C23C 10/28 (2013.01); C23C 10/30 (2013.01); C23C 10/60 (2013.01); C23C 24/08 (2013.01); C23F 1/20 (2013.01); C23F 1/44 (2013.01); C23F 17/00 (2013.01); C25D 5/50 (2013.01); C25D 3/12 (2013.01);
Abstract

A surface of an article is modified by first disposing a nickel-enriched region at the surface of a substrate, then enriching the nickel-enriched region with aluminum to form an aluminized region, and finally removing at least a portion of the aluminized region to form a processed surface of the substrate. Upon removal of this material, the roughness of the surface is reduced from a comparatively high initial roughness value to a comparatively low processed roughness value. In some embodiments, the processed roughness is less than about 95% of the initial roughness. Moreover, the sequence of steps described herein may be iterated one or more times to achieve further reduction in substrate surface roughness.


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