The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2018
Filed:
Feb. 08, 2011
Seigi Aoyama, Kitaibaraki, JP;
Toru Sumi, Hitachi, JP;
Hiromitsu Kuroda, Hitachi, JP;
Hideyuki Sagawa, Tokai-mura, JP;
Seigi Aoyama, Kitaibaraki, JP;
Toru Sumi, Hitachi, JP;
Hiromitsu Kuroda, Hitachi, JP;
Hideyuki Sagawa, Tokai-mura, JP;
HITACHI METALS, LTD., Tokyo, JP;
Abstract
A soft dilute copper alloy material includes 2 mass ppm to 12 mass ppm of sulfur, more than 2 mass ppm and not more than 30 mass ppm of oxygen, 4 mass ppm to 55 mass ppm of Ti, and a balance including copper. An average crystal grain size is not more than 20 μm in a surface layer up to a depth of 50 μm from a surface. The average crystal grain size in the surface layer is less than the average crystal grain size in an inner portion located more interiorly than the surface layer.