The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2018
Filed:
Feb. 15, 2013
Applicant:
Nippon Steel & Sumikin Stainless Steel Corporation, Tokyo, JP;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C21D 9/46 (2006.01); C22C 38/54 (2006.01); C22C 38/50 (2006.01); C22C 38/48 (2006.01); C22C 38/00 (2006.01); C22C 38/44 (2006.01); C22C 38/42 (2006.01); C22C 38/06 (2006.01); C22C 38/04 (2006.01); C22C 38/02 (2006.01); C21D 1/26 (2006.01); C22C 38/46 (2006.01); C25F 1/06 (2006.01); C23F 17/00 (2006.01); C23G 1/08 (2006.01); C21D 1/76 (2006.01); C21D 6/00 (2006.01); C21D 8/02 (2006.01); C21D 8/04 (2006.01); C21D 9/56 (2006.01);
U.S. Cl.
CPC ...
C21D 9/46 (2013.01); C21D 1/26 (2013.01); C21D 1/76 (2013.01); C21D 6/002 (2013.01); C21D 8/0278 (2013.01); C21D 8/0473 (2013.01); C21D 8/0478 (2013.01); C21D 9/561 (2013.01); C22C 38/00 (2013.01); C22C 38/001 (2013.01); C22C 38/004 (2013.01); C22C 38/008 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/42 (2013.01); C22C 38/44 (2013.01); C22C 38/46 (2013.01); C22C 38/48 (2013.01); C22C 38/50 (2013.01); C22C 38/54 (2013.01); C23F 17/00 (2013.01); C23G 1/086 (2013.01); C25F 1/06 (2013.01); C21D 2211/005 (2013.01); C23G 1/085 (2013.01); F01N 2530/04 (2013.01);
Abstract
This ferritic stainless steel sheet contains, by mass %: C: 0.02% or less, N: 0.02% or less, Si: 0.05% to 0.80%, Mn: 0.05% to 1.00%, P: 0.04% or less, S: 0.01% or less, Cr: 12% to 20%, Cu: 0.80% to 1.50%; Ni: 1.0% or less, Mo: 0.01% to 2.00%, Nb: 0.30% to 1.00%, Ti: 0.01% to less than 0.25%, Al: 0.003% to 0.46%, V: 0.01% to less than 0.15%, and B: 0.0002% to 0.0050%, with a remainder of Fe and inevitable impurities, wherein the following formulae (1) and (2) are satisfied, and an average Cu concentration in an area from a surface to a depth of 200 nm is 3.00% or less,