The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2018
Filed:
Mar. 20, 2015
Idemitsu Kosan Co., Ltd., Chiyoda-ku, JP;
Hiroki Fujinami, Narashino, JP;
Kenji Kobayashi, Chiba, JP;
IDEMITSU KOSAN CO., LTD., Chiyoda-ku, JP;
Abstract
Provided are a hot-melt adhesive having high flowability in a molten state and exhibiting high adhesion strength in bonding PP nonwoven fabrics and further exhibiting high adhesion strength in bonding PE film-PP nonwoven fabric, and a base polymer for a hot-melt adhesive. The hot-melt adhesive contains (A) a propylene-based polymer satisfying the following (Ai) to (Aiv), and (B) an olefin-based copolymer satisfying the following (Bi) and (Bii); and the base polymer for a hot-melt adhesive consists of a mixture of (A) a propylene-based polymer satisfying the following (Ai) to (Aiv) and (B) an olefin-based copolymer satisfying the following (Bi) and (Bii) and satisfies the following (1) and (2). (Ai) the melting point is 120° C. or lower, (Aii) the Mw is 10,000 to 150,000, (Aiii) the Mw/Mn is 2.5 or less, (Aiv) the penetration is 8 or less, (Bi) the penetration is 15 or more, (Bii) the melting point is 90° C. or higher, (1) the tensile elastic modulus at 23° C. is 400 MPa or less, and (2) the semi-crystallization time at 23° C. is 20 minutes or less.