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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10030141 B1

PDFFull Text
Date of Patent:
Jul. 24, 2018

Filed:

Oct. 18, 2013

Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board

Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Tomo Chiba, Tokyo, JP;

Hiroshi Takahashi, Tokyo, JP;

Eisuke Shiga, Tokyo, JP;

Takaaki Ogashiwa, Chiba-ken, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Christopher Polley

Int. Cl.
CPC ...
B32B 3/10 (2006.01); C08L 73/00 (2006.01); C08L 63/00 (2006.01); C08G 59/24 (2006.01); C08G 59/42 (2006.01); C08G 59/62 (2006.01); C08L 63/06 (2006.01); H05K 1/03 (2006.01); C08J 5/24 (2006.01); C08K 3/34 (2006.01); C08K 3/36 (2006.01); C08L 83/06 (2006.01); C08L 83/14 (2006.01); B32B 5/26 (2006.01); B32B 15/14 (2006.01); C08G 77/52 (2006.01); C08G 77/18 (2006.01);
U.S. Cl.
CPC ...
C08L 73/00 (2013.01); B32B 5/26 (2013.01); B32B 15/14 (2013.01); C08G 59/24 (2013.01); C08G 59/4246 (2013.01); C08G 59/621 (2013.01); C08J 5/24 (2013.01); C08K 3/34 (2013.01); C08K 3/36 (2013.01); C08L 63/00 (2013.01); C08L 63/06 (2013.01); C08L 83/06 (2013.01); C08L 83/14 (2013.01); H05K 1/0353 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/306 (2013.01); B32B 2307/3065 (2013.01); B32B 2457/08 (2013.01); C08G 77/18 (2013.01); C08G 77/52 (2013.01); C08J 2363/00 (2013.01); C08J 2373/00 (2013.01); C08J 2383/06 (2013.01); C08J 2463/00 (2013.01); C08J 2473/00 (2013.01); C08L 2201/02 (2013.01); C08L 2203/206 (2013.01); C08L 2205/025 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/029 (2013.01); H05K 2201/0275 (2013.01);
Abstract

An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, a laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).

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