The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2018
Filed:
Nov. 28, 2014
Applicant:
Shikoku Chemicals Corporation, Kagawa, JP;
Inventors:
Assignee:
SHIKOKU CHEMICALS CORPORATION, Kagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C07D 487/04 (2006.01); C08J 5/24 (2006.01); C08G 59/66 (2006.01); C08K 5/378 (2006.01); C09J 163/00 (2006.01); C23C 16/56 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/18 (2006.01); H05K 3/46 (2006.01); C08G 59/24 (2006.01); C08G 59/68 (2006.01);
U.S. Cl.
CPC ...
C07D 487/04 (2013.01); C08G 59/245 (2013.01); C08G 59/66 (2013.01); C08G 59/686 (2013.01); C08J 5/24 (2013.01); C08K 5/378 (2013.01); C08L 63/00 (2013.01); C09J 163/00 (2013.01); C23C 16/56 (2013.01); H05K 1/0298 (2013.01); H05K 1/0353 (2013.01); H05K 1/09 (2013.01); H05K 3/0017 (2013.01); H05K 3/18 (2013.01); H05K 3/4655 (2013.01); C08J 2363/00 (2013.01);
Abstract
The invention provides a mercaptoalkylglycoluril represented by the general formula (I): wherein Rand Reach independently represent a hydrogen atom, a lower alkyl group, or a phenyl group; R, R, and Reach independently represent a hydrogen atom or a mercaptoalkyl group selected from a mercaptomethyl group, a 2-mercaptoethyl group, and a 3-mercaptopropyl group; and n is 0, 1, or 2. The invention further provides an epoxy resin composition comprising an epoxy resin and the mercaptoalkylglycoluril, and a method for producing a laminate or a multilayer printed circuit board using the same.