The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Mar. 17, 2017
Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Rishun Kin, Handa, JP;

Hiroshi Takebayashi, Handa, JP;

Natsuki Hirata, Handa, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); H01L 21/00 (2006.01); H01L 23/00 (2006.01); B23K 20/00 (2006.01); H01L 21/683 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01L 21/67 (2006.01); H05B 3/62 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 20/004 (2013.01); B23K 1/0016 (2013.01); H01L 21/67103 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H05B 3/62 (2013.01); H05K 1/028 (2013.01); H05K 1/118 (2013.01); B23K 2201/42 (2013.01); H01L 21/67069 (2013.01);
Abstract

A metal wiring bonding structurecomprises contactsof connection FPCand heater landsof a sheet heaterto be bonded by a solder bonding memberA connection FPCincludes contact opposed landsformed of metal and disposed at positions respectively opposed to the plurality of contactson a surface of a support layeropposite from a surface on which metal wiresare provided. In addition to base surfacesopposed to the contactsthe heater landsrespectively include extended surfacesopposed to imaginary extended portionsimaginarily extended ahead from the contactsA solder bonding membercovers surfaces of the contact opposed landsa distal end surface of the connection FPCand the extended surfacesof the heater landsand is filled in a bonding space C.


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