The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Jul. 26, 2016
Applicant:

Continental Automotive Systems, Inc., Auburn Hills, MI (US);

Inventors:

Anthony J Polak, Lake Zurich, IL (US);

Jared Yagoda, Wauconda, IL (US);

Gerry Bianco, Elgin, IL (US);

Assignee:

Continental Automotive Systems, Inc., Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 7/20 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H05K 5/0017 (2013.01); H05K 5/0082 (2013.01); H05K 7/20854 (2013.01);
Abstract

An electronic controller having a housing, and a lower sub-assembly connected to a housing through the use of a laser weld, eliminating the use of a gasket and fasteners. The laser weld provides a sealed connection between the housing and the lower sub-assembly, preventing debris, moisture, oils, ATF, and chemicals from entering the housing, which protects the electrical components located inside the housing. The elimination of the gasket and fasteners also reduces the cost of the electronic controller. Depending upon the application, the electrical components may be mounted directly to the lower sub-assembly, or the electrical components may be mounted on a metal core. The metal core is used to provide heat dissipation and function as an electrical conductor. The lower sub-assembly may either be overmolded around the metal core, or the metal core may be attached to the lower sub-assembly after the lower sub-assembly has been formed.


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