The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

May. 11, 2017
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Xiao Ying Zhao, Santa Clara, CA (US);

Timothy S. Lui, Cupertino, CA (US);

Tyler B. Cater, Cupertino, CA (US);

Rasamy Phouthavong, Campbell, CA (US);

Scott A. Myers, Saratoga, CA (US);

Benjamin J. Pope, Mountain View, CA (US);

David A. Hurrell, San Mateo, CA (US);

Christopher R. Xydis, San Franscico, CA (US);

Edward S. Huo, Sunnyvale, CA (US);

Richard Hung Minh Dinh, Saratoga, CA (US);

Michael W. Firka, Cupertino, CA (US);

Martin J. Auclair, Cupertino, CA (US);

Kurtis J. Mundell, San Francisco, CA (US);

Salome Bavetta, Sunnyvale, CA (US);

Paul Leutheuser, Saratoga, CA (US);

Hani Esmaeili, Santa Clara, CA (US);

Kevin M. Froese, San Francisco, CA (US);

Ihtesham H. Chowdhury, Los Altos, CA (US);

Tang Yew Tan, San Francisco, CA (US);

Eric W. Bates, Sunnyvale, CA (US);

Yaocheng Zhang, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/02 (2006.01); H05K 5/02 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0217 (2013.01); H04R 1/025 (2013.01); H05K 7/1461 (2013.01); H04R 2499/11 (2013.01);
Abstract

An electronic device having several modifications designed to prevent liquid ingress into an opening (or openings) of the electronic device is disclosed. For example, the electronic device includes a SIM tray having a sealing element designed to provide a seal at an opening that receives the SIM tray. The sealing element may include a first section and a second section extending from the first section, with the first section designed to bend with respect to (and in some cases collapse onto) the second section. The electronic device may further include an audio module fitted with a sealing element. The sealing element may include extensions extending away from a main body of the sealing element, with some extension designed to engage the audio module, and other extensions designed to engage an audio module interface. The sealing element provides a seal against liquid ingress into the audio module.


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