The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
Aug. 08, 2016
Applicant:
General Electric Company, Schenectady, NY (US);
Inventors:
John Andrew Trelford, Dallas, TX (US);
William Lonzo Woods, Jr., Kaufman, TX (US);
Thang Danh Truong, Grand Prairie, TX (US);
Assignee:
GENERAL ELECTRIC COMPANY, Schenectady, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
B05C 17/06 (2006.01); H05K 3/34 (2006.01); H05K 3/12 (2006.01); B23K 3/06 (2006.01); H05K 1/11 (2006.01); B05D 1/32 (2006.01); H05K 3/40 (2006.01); B23K 1/00 (2006.01); B23K 3/08 (2006.01); H05K 1/09 (2006.01); C23C 18/06 (2006.01); B05C 17/08 (2006.01); B41N 1/24 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3484 (2013.01); B05C 17/06 (2013.01); B05D 1/32 (2013.01); B23K 1/0016 (2013.01); B23K 3/0638 (2013.01); B23K 3/08 (2013.01); H05K 1/09 (2013.01); H05K 1/112 (2013.01); H05K 1/115 (2013.01); H05K 3/1225 (2013.01); H05K 3/4053 (2013.01); H05K 3/4069 (2013.01); B05C 17/08 (2013.01); B23K 2201/42 (2013.01); B41N 1/247 (2013.01); C23C 18/06 (2013.01); H05K 3/1216 (2013.01); H05K 2201/0305 (2013.01); H05K 2203/1476 (2013.01);
Abstract
A method of printing solder paste in a component board and a stencil set for doing the same are disclosed. In one embodiment, the method includes using a first stencil having a first thickness to print solder paste into at least one through hole in the component board. The method further includes using a second stencil having a second thickness to print solder paste for at least one surface mounted part on the component board, subsequent to using the first stencil.