The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Aug. 07, 2014
Applicant:

Brose Fahrzeugteile Gmbh & Co. Kg, Wuerzburg, Wuerzburg, DE;

Inventors:

Steffen Ehrmann, Aub, DE;

Stefan Zick, Volkach, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H03K 17/567 (2006.01); H03K 17/687 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H03K 17/567 (2013.01); H03K 17/687 (2013.01); H05K 1/021 (2013.01); H05K 1/111 (2013.01); H05K 1/119 (2013.01); H05K 3/3452 (2013.01); H05K 3/202 (2013.01); H05K 2201/066 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/09909 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10969 (2013.01); Y02P 70/611 (2015.11);
Abstract

The present invention relates to a circuit board assembly, comprising a circuit board which has a first and a second solder region, which is galvanically separated from the first, and which furthermore has a separator arranged between the solder regions and rising out from the solder regions, having a power semiconductor component which has a housing having an output connection side, from which at least one control connection and a plurality of output connections protrude, which are arranged substantially adjacent to each other on the output connection side, wherein the control connection is electrically and mechanically connected to the first solder region and the output connections are electrically and mechanically connected to the second solder region and the control connection is separated from the output connections via the raised separator. The present invention furthermore relates to a control device for a cooler fan module of a motor vehicle and a method for assembling a power semiconductor component on a circuit board.


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