The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
Oct. 22, 2014
Applicant:
Sandisk Technologies Inc., Plano, TX (US);
Inventors:
Abhishek Ramesh Tambat, Santa Clara, CA (US);
Naveen Kini, San Jose, CA (US);
Elad Baram, Sunnyvale, CA (US);
Pradip Ghimire, San Jose, CA (US);
Assignee:
SanDisk Technologies LLC, Addison, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H05K 1/11 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 24/97 (2013.01); H05K 1/181 (2013.01); H01L 23/3128 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0652 (2013.01); H01L 25/105 (2013.01); H01L 25/18 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1435 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H05K 2201/10166 (2013.01);
Abstract
A semiconductor package such as a multi-chip package is disclosed. The semiconductor package may be configured for dual second level interconnection onto a printed circuit board of a host device. Thus, a single semiconductor package may be used on host printed circuit boards having different configurations.