The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
Jun. 09, 2016
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Yong Il Kwon, Suwon-si, KR;
Tah Joon Park, Suwon-si, KR;
Joon Seok Chae, Suwon-si, KR;
Jong Woo Choi, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 1/09 (2006.01); G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); G06K 9/0002 (2013.01); H05K 1/09 (2013.01); H05K 1/112 (2013.01); H05K 1/144 (2013.01); H05K 1/183 (2013.01); H05K 2201/049 (2013.01); H05K 2201/10151 (2013.01);
Abstract
A fingerprint sensing device includes a board having a sensor array, a sub-board disposed on a bottom surface of the board, a circuit element disposed on the bottom surface of the board, and a through hole disposed through the sub-board, wherein the circuit element is further disposed in the through hole. A thickness of the sub-board is substantially similar to a thickness of the circuit element.