The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
Apr. 14, 2015
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/06 (2006.01); H05K 1/05 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/02 (2013.01); G11B 5/484 (2013.01); G11B 5/4826 (2013.01); G11B 5/4833 (2013.01); G11B 5/4853 (2013.01); H05K 1/0266 (2013.01); H05K 3/06 (2013.01); H05K 3/4092 (2013.01); H05K 1/056 (2013.01); H05K 3/0041 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/0969 (2013.01); H05K 2203/0502 (2013.01); H05K 2203/0756 (2013.01); H05K 2203/167 (2013.01);
Abstract
A suspension board with circuit includes a metal supporting board, a conductive layer laminated on the metal supporting board, and a via layer interposed between the metal supporting board and the conductive layer. The conductive layer includes a conductive pattern, and a reference portion serving as a positioning reference for placing the suspension board with circuit on a load beam.