The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Jul. 17, 2017
Applicant:

Fotonation Cayman Limited, San Jose, CA (US);

Inventors:

Kartik Venkataraman, San Jose, CA (US);

Amandeep S. Jabbi, San Francisco, CA (US);

Robert H. Mullis, Santa Cruz, CA (US);

Assignee:

FotoNation Cayman Limited, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H04N 5/247 (2006.01); H04N 5/357 (2011.01); H04N 5/265 (2006.01); H04N 5/262 (2006.01); H04N 5/232 (2006.01); H04N 5/33 (2006.01); H04N 5/228 (2006.01); G06T 3/40 (2006.01); H04N 5/355 (2011.01); H04N 5/353 (2011.01); H04N 9/04 (2006.01); H04N 5/369 (2011.01); H04N 3/14 (2006.01); H04N 1/195 (2006.01); H01L 27/146 (2006.01); G06T 7/55 (2017.01); G06T 7/70 (2017.01); G02B 3/00 (2006.01); G02B 5/20 (2006.01); G02B 13/00 (2006.01); G02B 27/00 (2006.01); G06T 7/557 (2017.01); H04N 13/02 (2006.01); H04N 5/335 (2011.01); G06T 1/20 (2006.01); G02B 27/12 (2006.01); G02B 27/10 (2006.01); H04N 5/376 (2011.01); H04N 9/083 (2006.01); H04N 13/00 (2018.01);
U.S. Cl.
CPC ...
H04N 5/247 (2013.01); G02B 3/0006 (2013.01); G02B 5/20 (2013.01); G02B 5/208 (2013.01); G02B 13/0015 (2013.01); G02B 13/0085 (2013.01); G02B 27/0025 (2013.01); G02B 27/1066 (2013.01); G02B 27/123 (2013.01); G06T 1/20 (2013.01); G06T 3/4053 (2013.01); G06T 7/55 (2017.01); G06T 7/557 (2017.01); G06T 7/70 (2017.01); H01L 27/14618 (2013.01); H01L 27/14621 (2013.01); H01L 27/14625 (2013.01); H01L 27/14632 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); H04N 1/19589 (2013.01); H04N 1/19594 (2013.01); H04N 3/1593 (2013.01); H04N 5/228 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/2258 (2013.01); H04N 5/23212 (2013.01); H04N 5/23229 (2013.01); H04N 5/23232 (2013.01); H04N 5/23238 (2013.01); H04N 5/23296 (2013.01); H04N 5/262 (2013.01); H04N 5/265 (2013.01); H04N 5/2621 (2013.01); H04N 5/33 (2013.01); H04N 5/335 (2013.01); H04N 5/357 (2013.01); H04N 5/3537 (2013.01); H04N 5/3575 (2013.01); H04N 5/35545 (2013.01); H04N 5/3696 (2013.01); H04N 5/376 (2013.01); H04N 9/04 (2013.01); H04N 9/045 (2013.01); H04N 13/0022 (2013.01); H04N 13/0242 (2013.01); H04N 13/0257 (2013.01); G06T 2207/10052 (2013.01); G06T 2207/30244 (2013.01); H01L 2924/0002 (2013.01); H04N 1/195 (2013.01); H04N 2013/0081 (2013.01);
Abstract

A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.


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