The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Dec. 22, 2016
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Takumi Sugitani, Tokyo, JP;

Hitoshi Kurusu, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 1/02 (2006.01); H01L 23/00 (2006.01); H03F 3/195 (2006.01); H03F 3/45 (2006.01); H03F 1/08 (2006.01); H03F 3/187 (2006.01);
U.S. Cl.
CPC ...
H03F 1/0205 (2013.01); H01L 24/17 (2013.01); H03F 1/083 (2013.01); H03F 3/195 (2013.01); H03F 3/4508 (2013.01); H03F 3/187 (2013.01); H03F 2200/222 (2013.01); H03F 2200/387 (2013.01); H03F 2200/408 (2013.01); H03F 2200/451 (2013.01);
Abstract

According to the present invention, an integrated circuit includes a first amplifier stage, a second amplifier stage, a first signal line connecting an output of the first amplifier stage and an input of the second amplifier stage to each other, a first plane for ground connected to the first amplifier stage, a second plane for ground connected to the second amplifier stage and at least one at least one line for ground connecting the first plane and the second plane to each other, wherein the at least one line has a center line having a length of 10 μm to 1 mm, a width of the at least one line is ⅓ or less of a width of the first plane, and a pattern ratio is 1 or more.


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