The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Jun. 08, 2012
Applicants:

Michio Yamada, Tokyo, JP;

Yosuke Shinomoto, Tokyo, JP;

Hiroki Aso, Tokyo, JP;

Hiroyuki Ishii, Tokyo, JP;

Junichiro Oya, Tokyo, JP;

Inventors:

Michio Yamada, Tokyo, JP;

Yosuke Shinomoto, Tokyo, JP;

Hiroki Aso, Tokyo, JP;

Hiroyuki Ishii, Tokyo, JP;

Junichiro Oya, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02P 25/16 (2006.01); F24H 4/00 (2006.01); H02P 27/06 (2006.01); H02K 11/33 (2016.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H02P 25/16 (2013.01); F24H 4/00 (2013.01); H02K 11/33 (2016.01); H02P 27/06 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/181 (2013.01); H05K 1/0254 (2013.01); Y02B 30/12 (2013.01);
Abstract

A motor incorporating a power converter including a printed board on which a semiconductor module (an inverter IC), which converts a voltage of an external power supply into a high-frequency voltage and supplies the high-frequency voltage to a stator, is mounted, wherein a high-voltage circuit ground, which is a power ground of a high-voltage main circuit system of the inverter IC, and a low-voltage circuit ground, which is a ground of a control circuit system, which is a low-voltage circuit, of the semiconductor module, are provided on the board, and the high-voltage circuit ground and the low-voltage circuit ground are connected at one point via a resistor.


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