The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Apr. 17, 2014
Applicant:

Conti Temic Microelectronic Gmbh, Nuremberg, DE;

Inventors:

Hermann Baeumel, Neumarkt / Opf., DE;

Edmund Schirmer, Nuremberg, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02B 1/20 (2006.01); H05K 7/14 (2006.01); H01L 23/495 (2006.01); H02M 1/08 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H02B 1/20 (2013.01); H01L 23/49537 (2013.01); H01L 23/49548 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H02M 1/08 (2013.01); H05K 7/1432 (2013.01); H01L 24/06 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A power module for a power converter includes a first busbar with a first surface and a second surface opposite the first surface, a first semiconductor component on the first surface of the first busbar, which semiconductor component has a first surface with a first electrical surface contact connection and is connected, via the first surface contact connection, to the first surface of the first busbar in an electrically conductive and mechanical fashion over an area, and a second semiconductor component on the second surface of the first busbar, which semiconductor component has a first surface with a first electrical surface contact connection and is connected, via the first surface contact connection of the second semiconductor component, to the second surface of the first busbar in an electrically conductive and mechanical fashion over an area.


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